Low Pressure Molding For Electronic Protection
Low pressure molding materials are used to encapsulate and protect electronics against moisture, dust, dirt and vibration but feature faster processes than conventional potting. You’ll find products that help to shorten cycle times and offer greater design flexibility all while protecting against water, extreme temperatures, harsh chemicals, shock and vibration. The materials are used across all types of industries such as medical, electronic components, industrial applications among others.
ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.
General purpose high-end moldable polyamide with good adhesion, very good mechanical properties and improved internal cohesion for demanding industrial applications. Available in black only.
General purpose high-end moldable polyamide with good adhesion and improved internal cohesion for industrial applications. Available in black only.
Technomelt PA 678 provides a good balance of low and high-temperature performance.
Technomelt PA 646 BLACK high-performance thermoplastic polyamide is designed to meet low-pressure moulding process requirements.
Thermelt 867 is a high performance moldable polyamide with good adhesion and environmental thermal shock resistance.
Technomelt PA 682 thermoplastic, hot melt adhesive is designed for molding compound applications.
Technomelt PA 2384 is an opaque, light amber, physical setting, thermoplastic, polyamide hotmelt adhesive which is designed for applications that require good environmental, chemical and solvent resistance.
TECHNOMELT® PA 638 BLACK high performance thermoplastic polyamide is designed to meet low pressure moulding process requirements.