Low Pressure Molding

Low Pressure Molding 

Low pressure molding materials are used to encapsulate and protect electronics against moisture, dust, dirt and vibration but feature faster processes than conventional potting. You’ll find products that help to shorten cycle times and offer greater design flexibility all while protecting against water, extreme temperatures, harsh chemicals, shock and vibration. The materials are used across all types of industries such as medical, electronic components, industrial applications among others. 

 

ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.

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Bostik
Thermelt 861 HV

General purpose high-end moldable polyamide with good adhesion, very good mechanical properties and improved internal cohesion for demanding industrial applications. Available in black only. 

Bostik
Thermelt 867 HV

General purpose high-end moldable polyamide with good adhesion and improved internal cohesion for industrial applications. Available in black only. 

Henkel
Technomelt PA 678

Technomelt PA 678 provides a good balance of low and high-temperature performance.

Henkel
Technomelt PA 646

Technomelt PA 646 BLACK high-performance thermoplastic polyamide is designed to meet low-pressure moulding process requirements.

Bostik
Thermelt 867

Thermelt 867 is a high performance moldable polyamide with good adhesion and environmental thermal shock resistance. 

Henkel
Technomelt PA 682

Technomelt PA 682 thermoplastic, hot melt adhesive is designed for molding compound applications.

Henkel
Technomelt PA 2384

Technomelt PA 2384 is an opaque, light amber, physical setting, thermoplastic, polyamide hotmelt adhesive which is designed for applications that require good environmental, chemical and solvent resistance.

Henkel
Technomelt PA 638

TECHNOMELT® PA 638 BLACK high performance thermoplastic polyamide is designed to meet low pressure moulding process requirements.

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