Ruggedization For Electronics
ECT partners with various manufactures to offer top-of-the-line ruggedizing materials for many applications. Each compound provides a durable, long-lasting bond that protects against corrosion, humidity, and other environmental elements. These products can be used with many PCB applications including edge bonding, reinforcement, ball grid arrays, and video graphics arrays. Additionally, some products appear blue when first applied, then are colorless when cured with UV/Visible light.
ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.
One part, low corrosive industrial sealant with good primerless adhesion to many substrates including plastics.
Non-corrosive, neutral cure, one-part, RTV (room temperature vulcanising) silicone adhesive sealant
Color changing reinforcement adhesive for edgebonding and CSP reinforcement. This product cures upon exposure to UV/Visible light to quickly ruggedize components.
Multi-Cure chip-encapsulant material designed with a UV/visible light and secondary heat-cure system, making it ideal for encapsulation applications where shadow areas are present.
Room temperature stable encapsulant and wire bond adhesive with a secondary moisture cure.
Resilient chip encapsulant and wire bond adhesive designed for applications where a thixtropic, high-viscosity encapsulant or a damming material is required.