Ruggedization

Ruggedization

ECT partners with various manufactures to offer top-of-the-line ruggedizing materials for many applications. Each compound provides a durable, long-lasting bond that protects against corrosion, humidity, and other environmental elements. These products can be used with many PCB applications including edge bonding, reinforcement, ball grid arrays, and video graphics arrays. Additionally, some products appear blue when first applied, then are colorless when cured with UV/Visible light.

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CHT/Quantum Silicones
AS1604

One part, low corrosive industrial sealant with good primerless adhesion to many substrates including plastics. 

CHT/Quantum Silicones
AS1700

Non-corrosive, neutral cure, one-part, RTV (room temperature vulcanising) silicone adhesive sealant

Dymax
9309-SC

Color changing reinforcement adhesive for edgebonding and CSP reinforcement. This product cures upon exposure to UV/Visible light to quickly ruggedize components. 

Dymax
29824

Multi-Cure chip-encapsulant material designed with a UV/visible light and secondary heat-cure system, making it ideal for encapsulation applications where shadow areas are present.

Dymax
9014

Room temperature stable encapsulant and wire bond adhesive with a secondary moisture cure.

Dymax
9037-F

Resilient chip encapsulant and wire bond adhesive designed for applications where a thixtropic, high-viscosity encapsulant or a damming material is required. 

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