Low Pressure Molding

Low Pressure Molding 

Low pressure molding materials are used to encapsulate and protect electronics against moisture, dust, dirt and vibration but feature faster processes than conventional potting. You’ll find products that help to shorten cycle times and offer greater design flexibility all while protecting against water, extreme temperatures, harsh chemicals, shock and vibration. The materials are used across all types of industries such as medical, electronic components, industrial applications among others. 

Filter Results
LPMS USA
Spectra-Melt 793

Thermoplastic hotmelt polyamide resin designed for high demand humidity resistance applications with low vapor transmission rate. 

LPMS USA
Spectra-Melt 782

Thermoplastic hotmelt polyamide resin with excellent hardness and adhesion.

LPMS USA
Spectra-Melt 301

Thermoplastic hotmelt polyamide resin with the best high-temperaure creep resistance and UV resistance. 

Henkel
Technomelt PA 6208 N

TECHNOMELT PA 6208 thermoplastic, hot melt adhesive is designed for molding compound applications.

Henkel
Technomelt PA 633

TECHNOMELT® PA 633 (MACROMELT OM 633) is an amber, thermoplastic, physical setting polyamide hotmelt used for molding applications.

Bostik
Thermelt 861

Thermelt 861 is a general purpose moldable polyamide with good adhesion for industrial applications 

Bostik
Thermelt 866

Thermelt 866 is a moldable polyamide with excellent adhesion to PES, PC, and other demanding substrates. 

Henkel
Technomelt PA 652

TECHNOMELT PA 652 is well-suited to applications where excellent adhesion and cold temperature flexibility are demanded.

Henkel
Technomelt PA 657

TECHNOMELT® PA 657 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements.

LPMS USA
Spectra-Melt 791

Thermoplastic hotmelt polyamide resin with the best high-temperature creep resistance and good resistance against automotive fluid splash exposure. 

Back to top