Electronic Coating and Assembly Services for Consumer, Robotics, Optical, and Other Industries

ECT provides services and recommendations on conformal coating, masking, gasket, and potting materials used in various applications such as HEPA filters, sensors, board and package level shielding, PCB maskants, edge molding and gasketing.

EMI/RFI material shielding for consumer, robotics, optical, and other industry applications
EMI/RFI Shielding

Electronic Coating Technologies has been working with leading EMI/RFI material shielding manufacturers for over 20 years. We will find the best electronic shielding for your application and work with you through the entire application process.

Demonstration of gasketing materials being applied in consumer, robotics, optical, and other industry applications

ECT applies both electrically conductive and non-conductive form-in-place (FIP) and cured-in-place (CIP) gaskets. They are applied as a liquid, gel, or paste utilizing an automated dispensing system.

Example of man at computer prototyping/engineering NPI within the robotics field
Prototyping/Engineering NPI

ECT has over 20 years in assisting our customer base with protecting their electronics. We are fully equipped to aid you in designing your product through the concept phase all the way to high-volume productions.

3D Printing materials being dispensed from a machine
3D Printing

ECT has the capability to rapidly prototype with the use of fused deposition modeling, offering a wide variety of material to choose from with many different manufacturers  


Our Services

We're here to help you find the perfect solution for your technical electronic application while addressing challenges associated with environmental, safety, delivery, quality, and cost concerns. Learn more about the variety of services we offer at ECT. 

Conformal Coating

Applying a wide variety of conformal coatings to PCBs using automated equipment with a focus on repeatability and precision. 

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EMI/RFI Coatings

Applying conductive coatings for larger-scale enclosures and newer board-level and package-level shielding needs.  

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Potting & Encapsulation

Our potting and encapsulation services are tailored to meet your manufacturing process and application requirements.

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ECT can apply electrically conductive and non-conductive form-in-place (FIP) and cured-in-place (CIP) gaskets to seal out moisture, chemical exposure, provide sound/vibration dampening or create a barrier between substrates.  

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Ruggedized Electronics

Protecting electronics from shock and vibration helps prolong the life of the device. 

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Low Pressure Molding

ECT acts as a representative for LPMS-USA, distributing and subcontract manufacturing their low pressure molding materials and equipment.

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Optical Bonding

We offer a range of optical bonding services including the selection and application of adhesive materials used in optical assembly and lens bonding. 

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Fixtures & Molds

From 3D printed prototypes to aluminum master molds and silicone molds, we can engineer a solution for your application. 

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Custom Materials & Equipment

Looking for more? We also offer customized coating and equipment solutions to address bespoke applications. 

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Down Packing

Our down packing equipment services take your bulk materials and repackage them into your desired containers for more manageable handling. 

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Other Services We Offer

ECT rebuilds and services dispensing or spraying equipment including emergency line breaks. We also offer PCB cleaning and parts assembly services. 

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Get In Touch

We're here to help you find the right solution for your electronic application. Interested in learning more or have questions? Reach out, we want to hear from you!

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