Low pressure molding materials are used to encapsulate and protect electronics against moisture, dust, dirt and vibration but feature faster processes than conventional potting. You’ll find products that help to shorten cycle times and offer greater design flexibility all while protecting against water, extreme temperatures, harsh chemicals, shock and vibration. The materials are used across all types of industries such as medical, electronic components, industrial applications among others.
ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.
Thermoplastic hotmelt polyamide resin designed for high demand humidity resistance applications with low vapor transmission rate.
Thermoplastic hotmelt polyamide resin with excellent hardness and adhesion.
Thermoplastic hotmelt polyamide resin with the best high-temperaure creep resistance and UV resistance.
TECHNOMELT® PA 633 (MACROMELT OM 633) is an amber, thermoplastic, physical setting polyamide hotmelt used for molding applications.
TECHNOMELT PA 6208 thermoplastic, hot melt adhesive is designed for molding compound applications.
Thermelt 861 is a general purpose moldable polyamide with good adhesion for industrial applications
Thermelt 866 is a moldable polyamide with excellent adhesion to PES, PC, and other demanding substrates.
TECHNOMELT PA 652 is well-suited to applications where excellent adhesion and cold temperature flexibility are demanded.
TECHNOMELT® PA 657 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements.
Thermoplastic hotmelt polyamide resin with the best high-temperature creep resistance and good resistance against automotive fluid splash exposure.