Low Pressure Molding For Electronic Protection
Low pressure molding materials are used to encapsulate and protect electronics against moisture, dust, dirt and vibration but feature faster processes than conventional potting. You’ll find products that help to shorten cycle times and offer greater design flexibility all while protecting against water, extreme temperatures, harsh chemicals, shock and vibration. The materials are used across all types of industries such as medical, electronic components, industrial applications among others.
ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.
Thermoplastic hot melt polyamide resin with best-in-class high-temperature creep resistance and hardness.
TECHNOMELT® PA 653 is an amber, physical setting, thermoplastic polyamide hotmelt used for molding applications.
Excellent adhesion and stable in long-term exposure to moisture and harsh environments.
Thermelt 817R is a specialty moldable polyamide with very low application viscosity for demanding designs.
Thermelt 868 is a moldable polyamide with very good UV and moisture resistance, used for outdoor applications
Polyamide hotmelt adhesive suitable for bonding and low-pressure moulding. Can be used with a wide range of plastics and provides low-temperature flexibility, a wide service temperature range and superior moulding properties.
TECHNOMELT® PA673 is an amber-colored, high performance thermoplastic polyamide and designed to meet low pressure moulding process requirements.
Thermoplastic hot melt polyamide resin with excellent high-temperature resistance and stability for sealing electronics. It offers increased protection as a secondary overmold.
Spectra-Melt 282 Blaze Orange color, PCB encapsulation used for automotive battery and high voltage applications, resistance to automotive fluids with good high-temperature creep resistance.
Henkel Loctite Technomelt PA 687 is a polyamide that is formulated for very low water vapor transmission for the most demanding high humidity applications such as on the inside of an automobile tire.