Form-In-Place and Cure-In-Place Gaskets

Form-in-place (FIP) and cure-in-place (CIP) gaskets are liquid-applied sealing materials that cure directly on the substrate, eliminating the need for pre-cut gaskets. Electronic Coating Technologies distributes a wide selection of these materials with excellent adhesion to glass, metal, plastic, and plated surfaces. Available as one- or two-part solutions curable with atmospheric moisture, heat, or high-intensity UV/Visible LED light, these materials resist electromagnetic interference (EMI/RFI) and protect against air, dust, noise, and chemical exposure, making them well suited for electronics, aerospace, automotive, and industrial applications.

ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.