PCB potting compounds and encapsulants are essential for providing superior protection for electronic components and circuitry. At ECT, we know that each product design and manufacturing process can be complex, and it may be difficult to find a material that will exactly meet all the requirements for your application. With our extensive knowledge in the field, we can assist you in finding the most suitable compound to fit your needs. We work closely with our distribution partners to provide a variety of PCB potting compounds and encapsulants that offer protection against physical stress, thermal shock, chemical exposure, heat and humidity, all the while providing a great deal of electrical insulation. Our selection of potting compounds and encapsulants can be purchased for your in-house manufacturing process or can be used with our potting/encapsulation contract manufacturing services. Not sure where to start? Our team of technical experts can work with you to engineer a solution, from product selection to process development.
Premium, UL 94 V-0 recognized fire retardant epoxy potting compound that features excellent electrical properties and long working life.
A two-component polyurethane potting and encapsulating compound that carries a UL94 V-0 flammability rating
Blue fluorescing encapsulant/wire bond adhesive with secondary heat cure
2 Part 2-Part Cure, moderately cross-linked silicone polymer gel used to for potting and encapsulation.
100% silicone solids elastomer designed for electronic potting applications.
UV-curable edgebond adhesive ideal for quickly ruggedizing circuit board components.
UV/Visible light-curable resin designed for rapid rigid adhesive bonding and shallow potting (0.25 in/6mm) with a secondary heat or activator cure function in applications where shadow areas exist.
High-tensile-strength, UV-curable resin with secondary heat cure capability that is well suited when rigid adhesive bonds or potting areas are desired.
Light-curable potting resin with secondary heat cure capbility designed for achieving rigid adhesive bonds or potted areas.
Resilient chip encapsulant and wire bond adhesive formulated with secondary heat cure and a blue fluorescing tracer.