Potting Compounds & Encapsulants

Electronic Potting Compounds & Encapsulants

PCB potting compounds and encapsulants are essential for providing superior protection for electronic components and circuitry. At ECT, we know that each product design and manufacturing process can be complex, and it may be difficult to find a material that will exactly meet all the requirements for your application. With our extensive knowledge in the field, we can assist you in finding the most suitable compound to fit your needs. We work closely with our distribution partners to provide a variety of PCB potting compounds and encapsulants that offer protection against physical stress, thermal shock, chemical exposure, heat and humidity, all the while providing a great deal of electrical insulation. Our selection of potting compounds and encapsulants can be purchased for your in-house manufacturing process or can be used with our potting/encapsulation contract manufacturing services. Not sure where to start? Our team of technical experts can work with you to engineer a solution, from product selection to process development.

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Epic Resins
EPIC R1074-06/H4030-02

Premium, UL 94 V-0 recognized fire retardant epoxy potting compound that features excellent electrical properties and long working life.

Epic Resins
EPIC RM2018

A two-component polyurethane potting and encapsulating compound that carries a UL94 V-0 flammability rating

Dymax
29824

Blue fluorescing encapsulant/wire bond adhesive with secondary heat cure

CHT/Quantum Silicones
QGel 311UV

2 Part 2-Part Cure, moderately cross-linked silicone polymer gel used to for potting and encapsulation.

CHT/Quantum Silicones
Qsil 553

100% silicone solids elastomer designed for electronic potting applications.

Dymax
9309-SC

UV-curable edgebond adhesive ideal for quickly ruggedizing circuit board components.

Dymax
921-GEL

UV/Visible light-curable resin designed for rapid rigid adhesive bonding and shallow potting (0.25 in/6mm) with a secondary heat or activator cure function in applications where shadow areas exist.

Dymax
921-T

High-tensile-strength, UV-curable resin with secondary heat cure capability that is well suited when rigid adhesive bonds or potting areas are desired.

Dymax
921-VT

Light-curable potting resin with secondary heat cure capbility designed for achieving rigid adhesive bonds or potted areas.

Dymax
9037-F

Resilient chip encapsulant and wire bond adhesive formulated with secondary heat cure and a blue fluorescing tracer.

Light-Curable Potting Compounds for Electronic Components

Dymax potting materials provide strong, translucent bonds and are ideal for potting electronics, connectors, thermal switches, and sensors, as well as for tamper-proofing. They offer high adhesion to metal, glass, ceramic, and many phenolic, filled, and thermoset plastics.

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