Electronic Potting Compounds & Encapsulants

Potting compounds and encapsulants protect electronic components and circuitry against physical stress, thermal shock, chemical exposure, heat, humidity, and electrical interference — but selecting the right compound for your specific design and manufacturing requirements can be complex. ECT works closely with distribution partners to offer a broad selection of PCB potting compounds and encapsulants across multiple chemistries, cure types, and viscosities.

Not sure which compound is right for your application? Our technical team can help you work through material selection and process development, whether you're handling application in-house or looking for a contract manufacturing partner.

ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.