Parylene Conformal Coating

Dimer D Parylene Conformal Coatings

Parylene D is not supported by ECT at this time.

Parylene D raw materials contain hydrogen, carbon and two chlorine groups. While the properties are similar to Parylene C, Parylene D offers the greatest thermal stability, protecting the board at higher temperatures. 

Strengths

• Faster rate of deposition than Parylene N with thicker coating in less time
• Dielectric protection at 5.5k volts per 1 mil coating
• Excellent protection from moisture, chemicals, and corrosive gases
• Tensile strength of 11,000 psi
• Temperature tolerance at 120^◦C in presence of oxygen.
• Similar properties to C with higher temperature resistance and improved barrier capability against hydrogen sulfide

Weaknesses 

• Batch processing only
• Rework requires special equipment
• Time required to prepare and mask boards
• Lower dielectric strength than Parylene C
• Lacks sufficient biocompatibility for medical devices