Dimer N_2 Parylene Conformal Coating

Parylene Conformal Coating

Dimer D Parylene Conformal Coatings

Parylene D is not supported by ECT at this time.

Parylene D raw materials contain hydrogen, carbon and two chlorine groups. While the properties are similar to Parylene C, Parylene D offers the greatest thermal stability, protecting the board at higher temperatures. 


  • Faster rate of deposition than Parylene N with thicker coating in less time
  • Dielectric protection at 5.5k volts per 1 mil coating
  • Excellent protection from moisture, chemicals, and corrosive gases
  • Tensile strength of 11,000 psi
  • Temperature tolerance at 120C in presence of oxygen.
  • Similar properties to C with higher temperature resistance and improved barrier capability against hydrogen sulfide



  • Batch processing only
  • Rework requires special equipment
  • Time required to prepare and mask boards
  • Lower dielectric strength than Parylene C
  • Lacks sufficient biocompatibility for medical devices
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