Yes, parylene coating has hydrophobic properties repelling water and moisture.
Yes, this ultra-thin coating is cryogenic resistant to -200°C.
Yes, parylene N and parylene C met the requirements of USP Plastic Class VI. Testing completed by Advanced Coating.
Yes, the parylene (CVD) process will deposit the conformal coating on all surfaces of the PCB.
Yes, parylene C meets the requirements of Mil-I-46058C/IPC-CC-830-C. Testing completed by Advanced Coating.
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1 – Sublimination - The dimer granular is vaporized into a gas.
2 - Pyrolysis - The dimer gas is heated to a high temperature to produce a monomer gas that splits the dimer molecules.
3 - Deposition - The monomer gas is transferred to the coating vessel to deposit onto the PCB as an ultra-thin coating at room temperature.
4 - Chiller & Vacuum - The chiller captures the excess parylene at the end of the cycle. The vacuum pulls all the air and gasses from the chamber, facilitating the parylene deposition.
Parylene is an ultra-thin conformal coating that adds minimal weight to the PCB. The weight of the parylene layer over a 1” x 1” x .00125 mils on an FR4 board with no components is. 040 grams.
Yes, parylene is a uniform coating over complex and intricate surfaces, controlled during the deposition phase.
The parylene coating thickness can range from .1 to 50 microns (.001 – 2 mils). Typically, most customers require mil-spec standard thicknesses, which are repeatable and achievable batch after batch with our equipment.
The thickness of the parylene coating is impacted by the dimer mass, deposition rate, temperature, and other factors, such as the topography of the PCB.
The complexity of the PCB topography determines masking techniques. Masking options are liquid maskants such as UV-curable maskants, latex maskant, polyester or Kapton tape, caps, and boots (standardized or 3D printed).
Pre-treatment with silane stimulates parylene adhesion to promote a molecular bond from the substrate to the applied parylene coating.
Yes, all PCBs are cleaned before applying the adhesion promoter and the parylene process to ensure the adhesion of the parylene coating.