Electronic Potting Compounds & Encapsulants
PCB potting compounds and encapsulants are essential for providing superior protection for electronic components and circuitry. At ECT, we know that each product design and manufacturing process can be complex, and it may be difficult to find a material that will exactly meet all the requirements for your application. With our extensive knowledge in the field, we can assist you in finding the most suitable compound to fit your needs. We work closely with our distribution partners to provide a variety of PCB potting compounds and encapsulants that offer protection against physical stress, thermal shock, chemical exposure, heat and humidity, all the while providing a great deal of electrical insulation. Our selection of potting compounds and encapsulants can be purchased for your in-house manufacturing process or can be used with our potting/encapsulation contract manufacturing services. Not sure where to start? Our team of technical experts can work with you to engineer a solution, from product selection to process development.
ECT strives to provide technical support for the products we distribute. We regularly update our information, but cannot guarantee it is the most recent version from the manufacture. Please verify TDS and SDS on the manufacturer website for the most up to date information.
Room temperature stable encapsulant and wire bond adhesive with secondary moisture cure.
A filled, medium viscosity one component epoxy resin ideally suited for harsh environments that require exposure to such items as aviation fuels, Skydrol(R), gasoline, transmission fluid, as well as other hydraulic fluids.
Single component 100% solids epoxy resin potting compounds designed for impregnation of coils, transformers, motors and other electrical items needing insulation.
Vacuum grade modified epoxy electrical potting system that is formulated to achieve penetration of tightly wound electrical coils.
Two-component polyurethane potting compound formulated for applications requiring thermal stability at high temperatures.
Two-component polyurethane potting compound designed for use in low to high-frequency RF applications.
Two component, optically clear, room temperature curing epoxy potting compound.
One-component anhydride cure epoxy that can be used in both casting and small potting applications.
Two-component epoxy potting/casting compound designed for applications that require low water absorption and good chemical resistance in conjunction with good thermal conductivity.
Fire-resistant, two-component, filled epoxy electrical potting and casting system.
Light-Curable Potting Compounds for Electronic Components
Dymax potting materials provide strong, translucent bonds and are ideal for potting electronics, connectors, thermal switches, and sensors, as well as for tamper-proofing. They offer high adhesion to metal, glass, ceramic, and many phenolic, filled, and thermoset plastics.